User:ZyMOS/Guide to pkgs
From Wikihowto
http://www.renesas.com/media/products/common_info/package/pdf/jeitacode_e.pdf http://www.intel.com/design/packtech/packbook.htm http://images.google.com/images?q=PACKAGE+OUTLINE+DRAWING+site%3Asemiconductors.philips.com+GIF&btnG=Search&svnum=10&hl=en&lr=&safe=off Very detailed specifications for many device packages
nice pictures with names
- http://images.google.com/images?q=www.national.com/images/pkg/&svnum=10&hl=en&lr=&safe=off&start=0&sa=N&filter=0
- http://www.national.com/packaging/parts/#HERMETIC
- http://www.xs4all.nl/~ganswijk/chipdir/package.htm
Contents |
[edit] Common
[edit] Thru-Hole
[edit] Surface Mount
[edit] Leadless
[edit] ALL
| Image | Abbrv | Full Name |
|---|---|---|
| BQFP | Bumpered Quad Flat Package | |
| BQFPH | Bumpered Quad Flat Package with Heat spreader | |
| CBGA | Ceramic Ball Grid Array. | |
| CCC | Ceramic (leadless) Chip Carrier | |
| CDIP | Ceramic Dual In-line Package. | |
| CERQUAD | CERamic QUAD in-line package | |
| CLCC | Ceramic Leadless Chip Carrier. | |
| CMPAK | Compact Mini PAcKage Hitachi diode | |
| CMPAK | Compact Mini PAcKage Hitachi transistor | |
| CPGA | Ceramic Pin Grid Array. | |
| CSP | Laminated Chip Scale Package. | |
| CerDIP | CERamic Dual In-line Package. | |
| CerPack | CERamic flatPACK | |
| DFP | Dual Flat Package | |
| DIL | Dual In-Line (8,14,16,18,20,22,24,28,32,40,48) | |
| DIMM | Dual In-line Memory Module | |
| DIP | Dual In-line Package. | |
| DPAK | Deca-Watt Package Hitachi transistor | |
| DSO | Dual Small Outline package | |
| EBGA | Enhanced Ball Grid Array | |
| EQUAD | ||
| FC | Flip Chip | |
| FC-PGA | Flip Chip Pin Grid Array Intel term | |
| FPAK | Flat PAcKage Hitachi diode | |
| FBGA,FPBGA | Fine Pitch Ball Grid Array. | |
| FPQFP | Fine Pitch Quad Flat Package | |
| FPT | Fine Pitch Technology | |
| FQFP | Fine Pitch Quad Flat Package | |
| HDPAK | Huge Deca-watt PAcKage Hitachi transistor | |
| HQFI | Heat sinked QFI | |
| HQFP | Heat sinked QFP | |
| HQSOP | Hermetic QSOP (20,24) | |
| HSOI | Heat sinked SOI | |
| HSOJ | Heat sinked SOJ | |
| HSOP | Heat sinked SOP | |
| LCBGA | Low Cost Ball Grid Array. | |
| LCC | Leadless Chip Carrier or Leadless Ceramic Carrier | |
| LCCC | Leadless Ceramic Chip Carrier | |
| LDPAK | Large Deca-watt PAcKage Hitachi diode | |
| LFBGA | Unknown | |
| LGA | Land Grid Array | |
| LLD | LeadLess Diode Hitachi diode | |
| LQFP | Low profile QFP | |
| LRP | Large Resin Package Hitachi diode | |
| L-SIM | Single In-line Memory (Module) | |
| L-DIM | Dual In-line Memory (Module) | |
| Micro-PGA | Micro Pin Grid Array Intel term | |
| Micro-Array | Micro array | |
| Micro-SMD | Micro surface mount device | |
| MOP | Mini Oct-Lead Package Hitachi transistor | |
| MPAK | Mini PAcKage Hitachi transistor | |
| MQFP | Metric Quad Flat Package | |
| MQFP2 | Metric Quad Flat Package with heat sink | |
| MQFPH | Metric Quad Flat Package with Heat spreader | |
| MQUAD | Metric QUAD flat package | |
| OLGA | Organic Land Grid Array (Intel term) which uses Controlled Collapse Chip Connection (C4) | |
| PBGA | Plastic Ball Grid Array. | |
| PDIL | Plastic Dual In-Line package | |
| PDIP | Plastic Dual In-Line Package. | |
| PGA | Pin Grid Array. | |
| PLCC | Plastic Leaded Chip Carrier (20,28,32,44,52,68,84). | |
| PLCCH | Plastic Leaded Chip Carrier with Heat spreader | |
| PLGA | Plastic Land Grid Array Intel term | |
| PPGA | Plastic Pin Grid Array. | |
| PQ2 | Power Quad flat package type 2 | |
| PQFJ | SAME AS PLCC | |
| PQFP | Plastic Quad Flat Package | |
| PSOP | Plastic Small Outline package | |
| PSOP-2 | Plastic Small Outline package | |
| QFI | Quad Flat I-leaded package | |
| QFJ | Quad Flat J-leaded package | |
| QFN | Quad Flat Non-leaded package | |
| QFP | Quad Flat Package (44S10,44S14,48S10,64REC,80REC,100REC,120,128,160) | |
| QIL | Quad In-Line package | |
| QIP | Quad In-line Package | |
| QSOP | Quarter Size Outline Package (16,20,24,28) or Quality Small Outline Package | |
| QTCP | Quad Tape Carrier Package | |
| QUAD | QUAD in-line package | |
| QUIL | QUad In-Line package | |
| QUIP | QUad In-line Package | |
| SD | Side-brazed ceramic Dual in-line package | |
| SDIP | Shrink Dual In-line Package | |
| SECC | Single Edge Cartridge Connector Intel term | |
| SGA | Solder Grid Array | |
| SHRDIL | SHRink Dual In-Line (20,24,32,42,52,64) | |
| SIL | Single In-Line (9,13,17) | |
| SIMM | Single In-line Memory Module | |
| SIP | Single In-line Package | |
| SIP | Single In-line Package | |
| SMPAK | Super Mini Package Hitachi transistor | |
| SO-79 | ||
| SO | See SOIC | |
| SOD | Small Outline Diode | |
| SOG | Small Outline IC with Gull-wing leads | |
| SOI | Small Outline I-leaded package | |
| SOIC | Small Outline Integrated Circuit (same as SO) | |
| SOJ | Small Outline J-leaded package | |
| SONB | Small Outline Narrow-Body IC with gull-wing leads | |
| SONQFN | Small Outline Non-Leaded Package | |
| SOP | Small Outline Package. | |
| SOT | Small Outline Transistor. | |
| SOT-23 | Small Outline Transistor. | |
| SP-10 | Single in line Package 10 pin Hitachi transistor | |
| SP-12 | Single in line Package 12 pin Hitachi diode | |
| SPAK | Small PAcKage Hitachi transistor | |
| SQFP | Shrink Quad Flat Pack (32,48,64,80,208,240) | |
| SQFP2 | Shrink Quad Flat Package with heat sink | |
| SQFPH | Shrink Quad Flat Package with Heat spreader | |
| SRP | Small Resin Package Hitachi diode | |
| SSO | Single Small Outline package/ | |
| SSOP | Small Shrink Outline Package (20,24,28,48,56). | |
| SSP | Super Small resin Package Hitachi diode | |
| TAB | Tape Automated Bonding | |
| TCCN | Unknown | |
| TCSP | LAMINATED T chip scale package | |
| TD | Top-brazed ceramic Dual in-line package | |
| File:TFBGA 324L.gif | TEPBGA | Unknown |
| TFBGA | Unknown | |
| TO | Transistor single Outline package or Through-Hole Transistor | |
| TO92 | Unknown | |
| TO218 | Unknown | |
| TO220 | Unknown | |
| TO247 | Unknown | |
| TO251 | Unknown | |
| TO252 | Unknown | |
| TO262 | Unknown | |
| TO263 | Unknown | |
| TO92 | Unknown | |
| TQFP | Thin Quad Flat Package | |
| TQFP2 | Thin Quad Flat Package with heat sink | |
| TQFPT | Thin Quad Flat Package with 1.0 mm body Thickness | |
| TSOP | Thin Small Outline Package | |
| TSOPII | Thin Small Outline Package type II | |
| TSQFP | Thin Shrink Quad Flat Pack (44,64,100) | |
| TSSOP | Thin Shrink Small Outline Package (20,24,28,48,56). | |
| UCSP | LAMINATED U chip scale package | |
| FBGA,FPBGA | Fine Pitch Ball Grid Array. | |
| UMD | Ultra Mini Diode Hitachi transistor | |
| UPAK | Uni-Watt Package Hitachi diode | |
| URP | Ultra small Resin Package Hitachi transistor | |
| VQFN | Unknown | |
| VQFP | Very small Quad Flat Package | |
| VSO | Very Small Outline (40,56) | |
| VSOP | Very Small Outline Package | |
| VTQFP | Very Thin Quad Flat Package | |
| VTSOP | Very Thin Small Outline Package. | |
| ZIP | Zigzag In-line Package | |
| µBGA | Micro Ball Grid Array. |
