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This page contains all computer chip or integrated circuit packages. A chip package is what surrounds the integrated circuit die and connects the die's pads to the packages external pins.

Contents 1 ALL packages 1.1 Through Hole 1.1.1 Chip 1.1.2 Other 1.2 Surface Mount 1.2.1 Leads 1.2.2 Leadless 1.2.3 Ball Grid Array(BGA) 2 List of IC package names 2.1 Through-hole 2.1.1 DIL: Dual-Inline 2.1.2 SIL: Single-Inline 2.1.3 PGA: Pin Grid Array 2.1.4 ZIP 2.2 Surface Mount 2.2.1 J-Lead 2.2.1.1 DIL: Dual Inline 2.2.1.1.1 SOIC: Small Outline Integrated Circuit 2.2.1.1.2 SO: Small Outline 2.2.1.1.3 SOP: Small outline package 2.2.1.1.4 SOT: Small outline transistor package 2.2.1.1.5 SC 2.2.1.2 QIL: Quad Inline 2.2.1.2.1 QFP: Quad Flat Package 2.2.2 Leadless 2.2.2.1 QFN: Quad flat package, no-leads 2.2.2.2 SON: Small outline package, no-leads 2.2.2.3 BGA: Ball grid array 2.3 Others to be sorted 2.4 See Also 2.5 External Links

[edit] ALL packages

Howto identify integrated circuit(IC) chip packages/All images

Image	Abbrv	Full Name	JEDEC/JEITA
	BQFP	Bumpered Quad Flat Package
Upload image of chip package	BQFPH	Bumpered Quad Flat Package with Heat spreader
Upload image of chip package	CASON	Chip Array Small Outline No Lead
24 lead CERQUAD	CERQUAD	CERamic QUAD in-line package
68L CLCC	CLCC, CCC	Ceramic Leadless Chip Carrier, Ceramic Chip Carrier
4L CMPAK	CMPAK	Compact Mini PAcKage Hitachi diode/transistor
14L CERPACK	CerPack	CERamic flatPACK
Upload image of chip package	DPAK	Deca-Watt Package Hitachi transistor
Upload image of chip package	DSO	Dual Small Outline package
EQUAD_32L.gif	EQUAD
Upload image of chip package	FC	Flip Chip
FCBGA_256L.gif	FC-PGA	Flip Chip Pin Grid Array Intel term
Upload image of chip package	FPQFP, FQFP	Fine Pitch Quad Flat Package
Upload image of chip package	HDPAK	Huge Deca-watt PAcKage Hitachi transistor
Upload image of chip package	HQFI	Heat sinked QFI
Upload image of chip package	HQFP	Heat sinked QFP
Upload image of chip package	HSOI	Heat sinked SOI
Upload image of chip package	HSOJ	Heat sinked SOJ
Upload image of chip package	LDPAK	Large Deca-watt PAcKage Hitachi diode
Upload image of chip package	LGA	Land Grid Array
Upload image of chip package	LLD	LeadLess Diode Hitachi diode
LQFP_48L.gif	LQFP	Low profile QFP
Upload image of chip package	LRP	Large Resin Package Hitachi diode
Upload image of chip package	MLF	Micro Lead Frame (Amkor)
Upload image of chip package	MOP	Mini Oct-Lead Package Hitachi transistor
4L MPAK	MPAK	Mini PAcKage Hitachi transistor
Upload image of chip package	OLGA	Organic Land Grid Array (Intel term) which uses Controlled Collapse Chip Connection (C4)
Upload image of chip package	PILGA		ED-7311-18
PLCC_32L.gif	PLCC, PQFJ	Plastic Leaded Chip Carrier (20,28,32,44,52,68,84).
Upload image of chip package	PLCCH	Plastic Leaded Chip Carrier with Heat spreader
Upload image of chip package	PLGA	Plastic Land Grid Array Intel term
PPGA	PPGA	Plastic Pin Grid Array.
Upload image of chip package	PQ2	Power Quad flat package type 2
Upload image of chip package	PSOJ
Upload image of chip package	PZIP		ED-7311-17
	QFI	Quad Flat I-leaded package
Upload image of chip package	QFJ	Quad Flat J-leaded package
QFN	QFN	Quad Flat Non-leaded package (big heat conducting pad in the bottom)
Upload image of chip package	QIL	Quad In-Line package
Upload image of chip package	QIP	Quad In-line Package
Upload image of chip package	QTCP	Quad Tape Carrier Package
24 lead QUAD	QUAD	QUAD in-line package
Upload image of chip package	QUIL	QUad In-Line package
24 lead CERQUAD	QUIP	QUad In-line Package
Upload image of chip package	SD	Side-brazed ceramic Dual in-line package
Upload image of chip package	SECC	Single Edge Cartridge Connector Intel term
Upload image of chip package	SGA	Solder Grid Array
Upload image of chip package	SHRDIL	SHRink Dual In-Line (20,24,32,42,52,64)
Upload image of chip package	SIL	Single In-Line (9,13,17)
Upload image of chip package	SMPAK	Super Mini Package Hitachi transistor
6L SO-70	SO-70
Upload image of chip package	SOD	Small Outline Diode
Upload image of chip package	SOG	Small Outline IC with Gull-wing leads
Upload image of chip package	SOI	Small Outline I-leaded package
Upload image of chip package	SONQFN	Small Outline Non-Leaded Package
	SOP	Small Outline Package.
Upload image of chip package	SP-10	Single in line Package 10 pin Hitachi transistor
Upload image of chip package	SP-12	Single in line Package 12 pin Hitachi diode
	SPAK	Small PAcKage Hitachi transistor
Upload image of chip package	SRP	Small Resin Package Hitachi diode
Upload image of chip package	SSO	Single Small Outline package
Upload image of chip package	SSP	Super Small resin Package Hitachi diode
Upload image of chip package	TAB	Tape Automated Bonding
Upload image of chip package	TCCN	Unknown
Upload image of chip package	TD	Top-brazed ceramic Dual in-line package
Upload image of chip package	TO-218	Unknown
Upload image of chip package	TO-251	Unknown
	TO-252, SC-63	Unknown
TO-263_THIN_9L.gif	TO-263 thin	Unknown
	TO-263	Unknown
	TO-243, SC-62	Unknown
Upload image of chip package	TQFN	Thin Quad Flat Package with No-Lead
Upload image of chip package	UMD	Ultra Mini Diode Hitachi transistor
Upload image of chip package	UPAK	Uni-Watt Package Hitachi diode
Upload image of chip package	URP	Ultra small Resin Package Hitachi transistor
	VQFN	Very small Quad Flat No pins
	VSO	Very Small Outline (40,56)

[edit] Through Hole

[edit] Chip

Image	Abbrv	Full Name	JEDEC/JEITA
Upload image of chip package	SIP	Single In-line Package
	SDIP	Shrink Dual In-line Package
	DIP	Dual In-line Package.
Upload image of chip package	Micro-PGA	Micro Pin Grid Array Intel term
	CDIP	Ceramic Dual In-line Package.
	PGA	Pin Grid Array.		ED-7311-23
Upload image of chip package	ZIP	Zigzag In-line Package
Upload image of chip package	PDIL	Plastic Dual In-Line package
	PDIP	Plastic Dual In-Line Package.
24L_CerDIP.gif	CerDIP	CERamic Dual In-line Package.
Upload image of chip package	DIL	Dual In-Line (8,14,16,18,20,22,24,28,32,40,48)
	CerQUAD	Ceramic quad package
	CPGA	Ceramic pin grid array, w/ heat spreader
	CPGA	Ceramic pin grid array

[edit] Other

Image	Abbrv	Full Name	JEDEC/JEITA
	TO-126	Unknown
	TO-220	Unknown
TO247.GIF	TO-247	Unknown
TO262.JPG	TO-262	Unknown
TO264.GIF	TO-264	Unknown
	TO-92	Unknown
	TO-220	Unknown
	TO-220AB, SC-46	Unknown
	TO-220F	Unknown
	TO-3	Unknown
	TO-46	Unknown
	TO-5	Unknown

[edit] Surface Mount

[edit] Leads

Image	Abbrv	Full Name	JEDEC/JEITA
Upload image of chip package	DFP	Dual Flat Package
PQFP_132L.gif	PQFP	Plastic Quad Flat Package	ED-7311A
	QFP	Quad Flat Package (44S10,44S14,48S10,64REC,80REC,100REC,120,128,160)
Upload image of chip package	QSOP	Quarter Size Outline Package (16,20,24,28) or Quality Small Outline Package
	SOIC, SO	Small Outline Integrated Circuit (same as SO)
	SOIC (wide)	Small Outline Integrated Circuit (wide)
	SOIC (narrow)	Small Outline Integrated Circuit (narrow)
	SOJ	Small Outline J-leaded package
Upload image of chip package	SONB	Small Outline Narrow-Body IC with gull-wing leads
SOT-23_3L.gif	SOT-23	Small Outline Transistor.
	SQFP	Shrink Quad Flat Pack (32,48,64,80,208,240)
Upload image of chip package	SQFP2	Shrink Quad Flat Package with heat sink
Upload image of chip package	SQFPH	Shrink Quad Flat Package with Heat spreader
	SSOP	Small Shrink Outline Package (20,24,28,48,56).
TQFP_100L.gif	TQFP	Thin Quad Flat Package
Upload image of chip package	TQFP2	Thin Quad Flat Package with heat sink
Upload image of chip package	PSON		ED-7311-19
PSOP_44L.gif	PSOP	Plastic Small Outline package	ED-7311-19
PSOP-2_16L.gif	PSOP-2	Plastic Small Outline package
	PSSOP		ED-7311-20
Upload image of chip package	PHSOP		ED-7311-21
Upload image of chip package	MQFP	Metric Quad Flat Package
Upload image of chip package	HSOP	Heat sinked SOP
Upload image of chip package	HQSOP	Hermetic QSOP (20,24)
Upload image of chip package	MQFP2	Metric Quad Flat Package with heat sink
Upload image of chip package	MQFPH	Metric Quad Flat Package with Heat spreader
100L_metal_quad.gif	MQUAD	Metric QUAD flat package
TSOP1_32L.gif	TSOP 1	Thin Small Outline Package type 1	ED-7311-1
Upload image of chip package	TSOPII	Thin Small Outline Package type II	ED-7311-2
Upload image of chip package	TSQFP	Thin Shrink Quad Flat Pack (44,64,100)
TSSOP_24L.gif	TSSOP	Thin Shrink Small Outline Package (20,24,28,48,56).
Upload image of chip package	VQFP	Very small Quad Flat Package
Upload image of chip package	VSOP	Very Small Outline Package
Upload image of chip package	VTQFP	Very Thin Quad Flat Package
Upload image of chip package	VTSOP	Very Thin Small Outline Package.
	LFPAK
	LLDS
	Mini SOIC
	PMFP
	PSOT
	SO-70
	SO-73
	SO-74A
	SO-79
	SO-88, SC-70 6

[edit] Leadless

Image	Abbrv	Full Name	JEDEC/JEITA
	LCC	Leadless Chip Carrier or Leadless Ceramic Carrier
	QCCN
	SC-101
	LLP
LAMINATE_CSP_128L.gif	CSP	Laminated Chip Scale Package.
Upload image of chip package	LCCC	Leadless Ceramic Chip Carrier
LAMINATED_UCSP_32L.gif	UCSP	LAMINATED U chip scale package
LAMINATED_TCSP_24L.gif	TCSP	LAMINATED T chip scale package
	HVQFN

[edit] Ball Grid Array(BGA)

Image	Abbrv	Full Name	JEDEC/JEITA
TFBGA_128L.gif	TFBGA	Thin-profile Fine-pitch Ball Grid Array
	HBGA
	SHELLOP
UFBGA_100L.gif	FBGA,FPBGA	Fine Pitch Ball Grid Array.
Upload image of chip package	CBGA	Ceramic Ball Grid Array.
Upload image of chip package	µBGA	Micro Ball Grid Array.
	PFBGA	Plastic Fine Pitch Ball Grid Array 0.5mm	ED-7311-7
	PFBGA	Plastic Fine Pitch Ball Grid Array 0.8mm	ED-7311-8
FBGA_49L.gif	FBGA,FPBGA	Fine Pitch Ball Grid Array.
File:TFBGA 324L.gif	TEPBGA	Thermally Enhanced Plastic Ball Grid Array
Upload image of chip package	LFBGA	Leadless Fine Pitch Ball Grid Array
EBGA_268L.gif	EBGA	Enhanced Ball Grid Array
PBGA_481l.gif	PBGA	Plastic Ball Grid Array.
	LCBGA	Low Cost Ball Grid Array.
MICRO_ARRAY_16L.gif	Micro-Array	Micro array
MICRO_SMD_42L.gif	Micro-SMD	Micro surface mount device

[edit] List of IC package names

[edit] Through-hole

[edit] DIL: Dual-Inline

• DIP: Dual inline package 0.6" [1]
• Skinny DIP: Skinny Dual inline package 0.3" [2]
• CERDIP CDIP: Ceraminc Dual inline package [3]
• PDIP, PDIL: Plastic Dual In-Line package
• SDIP, SHRDIL: Shrink Dual inline package
• SPDIP: Shrink Plastic Dual In-line Package
• Hybrid DIP: Hybrid Dual In-line Package
• SBDIP: Side Brazed Dual In-line Package

[4]

• SBDIP-H: Side Brazed Dual In-line Package Hybrid [5]
• BBDIP-H: Bottom Brazed Dual In-line Package Hybrid [6]

[edit] SIL: Single-Inline

• SIP: Single in-line package

[edit] PGA: Pin Grid Array

• PGA: Pin grid array
• PPGA: Plastic pin grid array
• FCPGA: flip-chip pin grid array
• CPGA: Ceramic pin grid array
• OPGA: Organic pin grid array
• FC-PGA: Flip Chip Pin Grid Array (Intel)
• Micro-PGA: Micro Pin Grid Array Intel term

[edit] ZIP

• ZIP: zig-zag in-line package
• PZIP: plastic zig-zag in-line package

[edit] Surface Mount

[edit] J-Lead

[edit] DIL: Dual Inline

[edit] SOIC: Small Outline Integrated Circuit

• SOIC-N-EP: Small outline integrated circuit narrow body with exposed pads with heatsink [7]
• batwing SOIC, SOIC-BAT: Small outline integrated circuit thermally enhanced with fused leads (batwings) [8]
• Mini-SOIC: Mini Small outline integrated circuit JEDEC: MO-187-AA [9]

[edit] SO: Small Outline

• SO-70
• SO-73
• SO-74A
• SO-79
• SO-88, SC-70 6-lead [10]
• SSO: Single Small Outline package
• VSO: Very Small Outline

[edit] SOP: Small outline package

• SOP, SO, SOIC: Small-Outline Package
• PSOP: Plastic Small-Outline Package
• PSOP-2: Plastic Small Outline package thermally enhanced with heatsink on top [11]
• PSOP-2: Plastic Small Outline package thermally enhanced with heatsink on bottom [12]
• PSSOP: Plastic Shrink Small-Outline Package
• TSOP: Thin Small-Outline Package
• TSOP I: Thin Small Outline Package type 1
• TSOP II: Thin Small Outline Package type II
• TSSOP: Thin Shrink Small Outline Package [13]
• TSSOP: Thin Shrink Small Outline Package with Exposed Pad (on bottom) [14]
• Wide-TSSOP: Wide Thin Shrink Small Outline Package [15]
• SSOP, Shrink SO: Shrink Small-Outline Package [16]
• QSOP: Shrink Small-Outline Package [17]
• QSOP-EP: Shrink Small-Outline Package [18]
• HSOP: Heat sinked Small-Outline Package
• HQSOP: Hermetic Quad Small-Outline Package
• VSOP: Very Small Outline Package
• uSOP, uMAX: micro Small Outline Package
• MSOP, micro-SOIC: Mini Small Outline Package [19]
• MSOP-EP: Mini Small Outline Package Exposed pads [20]

[edit] SOT: Small outline transistor package

Small Outline Transistor package

• PSOT
• SOT-23: Small Outline Transistor package (3,5,6, or 8 Leads) [21]
• SOT-66: Small Outline Package [22]
• SOT-89: Small Outline Package
• SOT-143: 4 Lead Small Outline Transistor Package [23]
• SOT-223: Small Outline Transistor Package (4 or 5 Leads) [24]
• TSOT-23: [25]

[edit] SC

• SC-101
• SC-70: Shrink Small outline transistor [26]

[edit] QIL: Quad Inline

[edit] QFP: Quad Flat Package

The quad flat package (QFP) is a thin flat square or rectangular package with J-Leads on all 4 sides.

• QFP: Quad Flat Package
• BQFP: Bumpered Quad Flat Package
• BQFPH: Bumpered Quad Flat Package with Heat spreader
• CQFP: Ceramic Quad Flat Package
• FPQFP, FQFP: Fine Pitch Quad Flat Package
• HQFP: Heat sinked Quad Flat Package
• LQFP: Low Profile Quad Flat Package
• MQFP, MQUAD: Metric Quad Flat Package [27]
• MQFP2: Metric Quad Flat Package with heat sink
• MQFPH: Metric Quad Flat Package with Heat spreader
• PQFP: Plastic Quad Flat Package
• SQFP: Small Quad Flat Package
• TQFP: Thin Quad Flat Package [28]
• TSQFP: Thin Shrink Quad Flat Pack
• VQFP: Very small Quad Flat Package
• VTQFP: Very Thin Quad Flat Package
• SQFP2, SQFPN: Shrink Quad Flat Package with heat sink
• TQFP2: Thin Quad Flat Package with heat sink

[edit] Leadless

[edit] QFN: Quad flat package, no-leads

• QFN - quad flat non-leaded package [29]
• PQFN - power quad flat non-leaded package
• SONQFN: Small Outline quad flat non-leaded package
• TQFN: Thin quad flat non-leaded package
• VQFN: very small quad flat non-leaded package
• HVQFN:Heatsink Very-thin Quad Flat-pack No-leads [30]
• DR QFN:
• DQFN: Depopulated very-thin Quad Flat-pack No-leads [31]

[edit] SON: Small outline package, no-leads

• SON: Small outline package, no-leads
• PSON: Plastic Small outline package, no-leads
• XSON, MicroPak: eXtremely thin Small Outline No leads [32]

[edit] BGA: Ball grid array

• BGA: Ball grid array
• BGA1: Ball grid array (Intel)
• BGA2: Ball grid array (Intel)
• CBGA: Ceramic ball grid array [33]
• PBGA: Plastic ball grid array
• FBGA, FPBGA: Fine pitch ball grid array
• LFBGA - low profile fine pitch ball grid array JEDEC Standard No. 75, JESD75 [34]

[35]

• μBGA - micro-ball grid array
• HBGA Heat Spreader Ball Grid Array
• HBGA: Hybrid Ball Grid Array [36]
• TFBGA: Thin-profile Fine-pitch Ball Grid Array
• PFBGA: Plastic Fine Pitch Ball Grid Array 0.5mm
• PFBGA: Plastic Fine Pitch Ball Grid Array 0.8mm
• TEPBGA: Thermally Enhanced Plastic Ball Grid Array
• EBGA: Enhanced Ball Grid Array
• LCBGA: Low Cost Ball Grid Array
• CSBGA: [37]
• VFBGA: very-thin, fine-pitch ball grid array JEDEC JC-11 registration - MO-225 [38]

[39]

• Micro-Array
• Micro-SMD
• CSPBGA: Chip Scale Package Ball Grid Array [40]
• SBGA: Thermally Enhanced Ball Grid Array with Heatsink [41]

[edit] Others to be sorted

CSP

• CSP: Wafer level chip scale package
• WL-CSP, WLCSP, WCSP, Nanostar: Wafer level chip scale package
• UCSP: LAMINATED U chip scale package [42]
• TCSP: LAMINATED T chip scale package
• LFCSP: LeadFrame chip scale package

WLP

• WLP: Wafer level package

CGA

• CCGA - ceramic column grid array
• CGA - column grid array

LGA

• LGA: land grid array
• PLGA: Plastic land grid array
• CLGA: Ceramic land grid array
• PILGA:
• CSLGA: [43]

SOJ

• SOJ: small outline J-lead
• HSOJ: Heat sinked small outline J-lead
• PSOJ: plastic small outline J-lead

LCC, QFJ

• LCC, QFJ - Leadless Chip Carrier [44]
• PLCC, PQFJ, : plastic leaded chip carrier [45]
• CLCC, CQFJ, LCCC: ceramic leaded chip carrier

TO

• TO-3
• TO-5 Plastic Header Package with flat index thru-hole [46]
• TO-8: Metal Header Package thru-hole [47]
• TO-46
• TO-51: Metal Header Package thru-hole [48]
• TO-51: Metal Header Package thru-hole
• TO-52: Metal Header Package thru-hole [49] [http://pdfserv.maxim-ic.com/package_dwgs/21-0019.PDF
• TO-78: Metal Header Package thru-hole [50]
• TO-92 Plastic Header Package with flat index thru-hole [51]
• TO-99: Metal Header Package thru-hole [52]
• TO-100: Metal Header Package thru-hole [53]
• TO-126
• TO-218
• TO-220
• TO-220AB, SC-46
• TO-220F
• TO-243, SC-62
• TO-247
• TO-251
• TO-252, SC-63, DPAK
• TO-262
• TO-263 thin
• TO-263, D2PAK
• TO-264
• TO-268, D3PAK

CO chip-on, Non-packaged devices

• COB - chip-on-board
• COF - chip-on-flex
• COG - chip-on-glass

PAK

• DPAK: Deca-Watt Package (Hitachi) transistor
• HDPAK: Huge Deca-watt PAcKage (Hitachi) transistor
• LDPAK: Large Deca-watt PAcKage (Hitachi) diode
• MPAK: Mini PAcKage (Hitachi) transistor
• SMPAK: Super Mini Package (Hitachi) transistor
• SPAK: Small PAcKage (Hitachi) transistor
• UPAK: Uni-Watt Package (Hitachi) diode
• LFPAK

MLP

• MLP: Micro Lead Frame Package
• MLF: MicroLeadFrame (Amkor)
• MLFQ: Micro Lead Frame Quad Package (Quad)
• MLFD: Micro Lead Frame Package (Dual)

• SP: Single in line Package (Hitachi) transistor
• SRP: Small Resin Package (Hitachi) diode
• SSP: Super Small resin Package (Hitachi) diode
• UMD: Ultra Mini Diode (Hitachi) transistor
• URP: Ultra small Resin Package (Hitachi) transistor

• TAB: Tape Automated Bonding
• MELF: Metal ELectrical Face
• MLP - Leadframe package
• TCCN:

• CASON: Chip Array Small Outline No Lead
• CERQUAD: CERamic QUAD in-line package
• CMPAK: Compact Mini PAcKage Hitachi diode/transistor
• CerPack: CERamic flatPACK
• SOD - Small outline diode

• SOG: Small Outline IC with Gull-wing leads
• DSO: Dual Small Outline package
• EQUAD
• FC: Flip Chip

I-leaded package

• QFI: Quad Flat I-leaded package
• HQFI: Heat sinked Quad Flat I-leaded package
• SOI: Small Outline I-leaded package
• HSOI: Heat sinked Small Outline I-leaded package

• LLD: LeadLess Diode (Hitachi)
• QFJ: quad flat J-lead
• LRP: Large Resin Package (Hitachi) diode

• MOP: Mini Oct-Lead Package (Hitachi) transistor
• PLCCH: Plastic Leaded Chip Carrier with Heat spreader
• PQ2: Power Quad flat package type 2

• QIL, QIP,QUIP , QUAD, QUIL: Quad In-line Package
• QTCP: Quad Tape Carrier Package
• SD: Side-brazed ceramic Dual in-line package
• SECC: Single Edge Cartridge Connector (Intel)
• SGA: Solder Grid Array

• MELF: Metal ELectrical Face
• MLP - Leadframe package
• TD: Top-brazed ceramic Dual in-line package
• CerQUAD: Ceramic quad package
• DFP: Dual Flat Package
• SONB: Small Outline Narrow-Body IC with gull-wing leads

• LLDA
• PMFP

• LCC: Leadless Chip Carrier or Leadless Ceramic Carrier
• LCCC: Leadless Ceramic Chip Carrier

• QCCN
• LLP

• SHELLOP
• MicroDFN, uDFN: [54]
• Ultra Thin MicroDFN: [55]
• SideBraze [56]
• WLP: WAFER LEVEL PACKAGE
• BCC:
• LPCC:
• MFL:
• PoP: Package-on-Package

• FLATPACK: Ceramic Flat Package [57] [58]

[edit] See Also

• Guide to computer chip or integrated circuit identification

[edit] External Links

• JEITA package standards downloads
• http://www.standardics.nxp.com/packaging/package.outlines/
• http://www.nxp.com/package/
• http://www.analog.com/Analog_Root/Packages/Packages_Home/0,2299,1,00.html