Howto identify chip packages/I-lead package
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Contents |
[edit] FLATPACK
| Image | Abbrv | Full Name | JEDEC/JEITA |
|---|---|---|---|
| | FLATPACK | Ceramic Flat Package | [1] [2] |
[edit] CERPACK
| Image | Abbrv | Full Name | JEDEC/JEITA |
|---|---|---|---|
| | CerQUAD, CERQUAD, CERPACK QUAD | CERamic QUAD in-line package | [3] |
| | CERPACK | CERamic flatPACK | [4] |
| | CERPACK Gull-wing, CQGP | CERamic flatPACK with gull-wing leads | [5] |
[edit] QFI
| Image | Abbrv | Full Name | JEDEC/JEITA |
|---|---|---|---|
| | QFI | Quad Flat I-leaded package | |
| | HQFI | Heat sinked Quad Flat I-leaded package |
[edit] SOI
| Image | Abbrv | Full Name | JEDEC/JEITA |
|---|---|---|---|
| | SOI | Small Outline I-leaded package | |
| | HSOI | Heat sinked Small Outline I-leaded package |
