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• SGA: Solder Grid Array

Contents 1 BGA: Ball grid array 2 MICRO SMD 3 CSP: chip scale package 3.1 FC: Flip Chip 4 CGA: Column Grid Array 5 Other

[edit] BGA: Ball grid array

• BGA: Ball grid array

Image	Abbrv	Full Name	JEDEC/JEITA
	BGA1	BGA (Intel Pentium II)
	BGA2: BGA (Intel Pentium III)
	CBGA	Ceramic BGA	[1]
	CVBGA	Very Thin Chip Array BGA	(Amkor) [2]
	CSBGA	?	[3]
	CSPBGA	Chip Scale Package BGA	[4]
	CABGA	Chip array BGA	(Amkor) [5]
	CTBGA	ChipArray Thin Core BGA	(Amkor) JEDEC MS-034 [6]
	CMBGA, CmBGA	Ceramic mini BGA
	CDTBGA	Cavity Down Tape BGA	[7]
	DBGA	Dimpled BGA	[8]
	DSBGA	Die size BGA	[9]
	D2BGA	Die Dimension BGA	(NEC) [10]
	ezBGA	?
	EBGA	(thermally) Enhanced BGA	[11]
	EDHSBGA	Exposed Drop-In Heat Sink BGA	[12]
	FBGA, FPBGA	Fine pitch BGA	JEDEC MO-205 [13]
	fcLBGA	Flip chip low profile BGA
	SG-FCLBGA	Silicon green flip chip low profile BGA	[14]
	FCBGA, FC-BGA	Flip Chip BGA
Image:-----	HP-fcBGA,	High performance flip Chip BGA	[15]
Image:-----	XP-fcBGA	Extra performance flip Chip BGA	[16]
	HBGA	Heat Spreader BGA
	HBGA	High power BGA	[17]
	HBGA	Hybrid fine line flip chip BGA	[18]
	HSBGA	Heat Slug/spreader/sink BGA
	HPBGA	High Performance BGA	[19]
	LFBGA	Low profile fine pitch BGA	JEDEC Standard No. 75, JESD75 [20] [21]
	LCBGA	Low Cost BGA
	L2BGA	Laser Laminated BGA
	LBGA	Laminate BGA
	LBGA	Low-Profile BGA	[22]
	LTBGA	Low-Profile Tape BGA
	MBGA	Metal substraight BGA
	M2BGA	Mitsui mini BGA
	MCBGA	Multi-Chip BGA	[23]
	MCM-PBGA, MCM-BGA	Multi-Chip Module Plastic BGA	JEDEC MS-034 [24]
	MCM-CBGA, MCM-BGA	Multi-Chip Module Ceramic BGA	JEDEC MS-034 [25]
	MOSFET BGA	MOSFET BGA	[26]
	PBGA	Plastic BGA	[27]
	PFBGA	Plastic Fine Pitch BGA	[28]
	SBGA	Spreader BGA, heatsink	[29]
	STFBGA	Stacked Thin profile Fine pitch BGA	[30]
	SBGA	SuperBGA	(Amkor) JEDEC MO-192 [31]
	TBGA	Tape BGA	[32]
	TFBGA	Thin-profile Fine-pitch BGA	[33]
	TEPBGA	Thermally Enhanced Plastic BGA	[34]
	TFTBGA	Thin profile Fine pitch Tape BGA	[35]
	TABGA	TapeArray BGA	(.5, .8, 1.0mm Pitch) (Amkor) JEDEC Compliant MO-195—0.5mm, MO-216—0.8mm, MO-192—1.0mm [36]
	UFBGA	Laminated Plastic BGA?	[37]
	ViperBGA		(ProLinx) [38]
	VBGA	Very Thin Profile Ball-Grid-Array
	VFBGA	very thin profile, fine pitch BGA	JEDEC JC-11 registration - MO-225 [39] [40]
	μBGA, uBGA, MBGA	micro BGA
	UBGA	Ultra thin BGA
	μFCBGA, uFCBGA	micro Flip Chip BGA	Pentium 4
	??????	Bumped Die, Flip Chip on Substrate	[41]

[edit] MICRO SMD

Image	Abbrv	Full Name	JEDEC/JEITA
	Micro-SMD	?	[42]
	Micro-SMD-A	?
	Thin MICRO SMD	?	[43]
	MICRO SMDxt	?	[44]
	MICRO-ARRAY	?	[45]

[edit] CSP: chip scale package

CSP: Laminated Wafer level CSP , WL: Wafer level [46]

Image	Abbrv	Full Name	JEDEC/JEITA
	3DS-WLCSP	3d Stacking Wafer-Level CSP
	CSP^nl	True Wafer level CSP	[47]
	CSP^nl-BOP	Bump on Pad CSP	(Amkor) [48]
	CSP^nl-Bump on Repassivation / Redistribution	(Amkor) [49]
	etCSP	Extremely Thin CSP (Amkor) Same as XFBGA, WFBGA ?)	[50]
	fcCSP, FCCSP	Flip Chip CSP	[51]
	FFCSP	flexible carrier folded real CSP
	M2CSP	?
	Memory CSP	?
	MCSP	?
	NCSP	Near CSP
	PBCSP	Polymer Bumper CSP
	WL-CSP, WLCSP, WCSP, Nanostar WLP	Wafer level CSP
	UCSP	LAMINATED U CSP	[52] [53]
	TCSP	LAMINATED T CSP	[54]
	tsCSP	Thin substrate CSP	JEDEC MO-247 [55]
	LFCSP	LeadFrame CSP	(Analog Devices)
	SuperFC	Super flip chip	(Amkor) JEDEC MS-034 [56]
	SCSP	Stacked CSP

[edit] FC: Flip Chip

Image	Abbrv	Full Name	JEDEC/JEITA
	FCiP	FC in Package
	FLMP	FC in a Leaded Molded Package	(Fairchild)
	SuperFC	Super FC	(Amkor) JEDEC MS-034 [57]

[edit] CGA: Column Grid Array

Collumn grid array (CGA)

Image	Abbrv	Full Name	JEDEC/JEITA
	CCGA	ceramic column grid array	[58]
	CuCGA	Copper Column Grid Array	[59]

[edit] Other

Image	Abbrv	Full Name	JEDEC/JEITA
	SHELLOP	?